HOWTSEN Intl. Electronics Metal Co., Ltd. | BGA Solder Ball Process 1 |
|||||||||||||||||
|
|||||||||||||||||
|
|
||||||||||||||||
HOWTSEN Intl. Electronics Metal Co., Ltd. Tel: +886 3 4777517 Fax: +886 3 4 777520 No. 12, Lane 130, Sec. 2, Zhung San E. Rd., Sin Wu, Taoyuan, 327, Taiwan Copy Right 2010 HOWTSEN
|