HOWTSEN Intl. Electronics Metal Co., Ltd. | BGA Solder Ball 
Product 2
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Purpose & Use P2 > |
Products Information Purpose & Use |
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Why use BGA Solder ball process
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the Use on IC field
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The purpose image
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豪岑電子金屬股份有限公司 Tel: +886 3 4777517 Fax: +886 3 4 777520
台灣 327桃園縣新屋鄉中山東路二段130巷12號
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