HOWTSEN Intl. Electronics Metal Co., Ltd. | BGA Solder Ball 
Product 3
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PDA & Smart Phone Module
Mobile phone
Mother Board
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HOWTSEN Intl. Electronics Metal Co., Ltd. Tel: +886 3 4777517 Fax: +886 3 4 777520
No.12, Lane 130, Sec. 2, Zhung San E. Rd., Sin Wu, Taoyuan, 327 Taiwan
Copy Right 2010 HOWTSEN