HOWTSEN Intl. Electronics Metal Co., Ltd. |BGA Solder Ball ball1ball1ball1ball1ball1ball1ball1ball1ball1ball1 Product 1

   
English
 
正體中文
 
簡体中文
     
micro ball

Composition and spec. P1 >

Purpose & object P2 >

Application P3 >

Company profile >

Products >

Process & QA >

Contact us >

Home page > 

 

Products Information Composition and Specification

composition

spec

 


 
   

logo1 HOWTSEN Intl. Electronics Metal Co., Ltd. Tel: +886 3 4777517 Fax: +886 3 4 777520

No. 12, Lane 130, Sec. 2, Zhung San E. Rd., Sin Wu, Taoyuan 327 Taiwan

Copy Right 2010 HOWTSEN